Protection to electronics with the highest level of reliability from corrosion damage, even though the product housing has large holes, with a high likelihood of water pooling in the device.
Requires the ability to solder-through the PCBA coatings to allow re-work and re-population of the boards to maximise functionality.
Mechanical seals are not a viable options as inherent holes and gaps are actively built in due to criticality for 5G connection.
Parylene can’t be soldered through nor reused effectively.
Liquid dispensed methods can attenuate signals which is not acceptable for reliable connections for the timely transfer of data, are not well adhered to the PCBAs and can’t maximise reliable performance.
Barrier coating will be critical post SMT for all products to prevent corrosion damage and product failure when water and environmental challenges inevitably get inside the device.
The resulting increase in product life-cycle will lower the total cost of ownership and reduce the engineer call-outs to fix expensive in-field issues.
Additional benefits of providing Splash-proof to reduce water ingress will depend on the specific product design and environmental challenge defined in the qualification and reliability standards.